The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Jul. 12, 2013
Applicants:

Tokyo Electron Limited, Tokyo, JP;

Air Liquide America Corporation, Newark, DE (US);

Inventors:

Steven P Consiglio, Albany, NY (US);

Robert D Clark, Livermore, CA (US);

Christian Dussarrat, Wilmington, DE (US);

Vincent Omarjee, Grenoble, FR;

Venkat Pallem, Hockessin, DE (US);

Glenn Kuchenbeiser, Newark, DE (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/469 (2006.01); C23C 16/00 (2006.01); C23C 16/30 (2006.01); C23C 16/455 (2006.01); H01L 21/28 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02181 (2013.01); H01L 21/02189 (2013.01); H01L 21/02194 (2013.01); H01L 21/02148 (2013.01); H01L 21/02159 (2013.01); H01L 21/02161 (2013.01); H01L 21/0228 (2013.01); H01L 21/02326 (2013.01); H01L 21/02332 (2013.01); H01L 21/02337 (2013.01); C23C 16/308 (2013.01); C23C 16/45531 (2013.01); H01L 21/28194 (2013.01); H01L 29/518 (2013.01);
Abstract

A method is provided for forming a nitrided high-k film in an atomic layer deposition process (ALD) process. The method includes receiving a substrate in a process chamber, maintaining the substrate at a temperature sufficient for ALD of a nitrided high-k film, and depositing the nitrided high-k film on the substrate by exposing the substrate to a gas pulse sequence that includes, in any order: a) exposing the substrate to a gas pulse comprising a metal-containing precursor, b) exposing the substrate to a gas pulse comprising an oxygen-containing gas, and c) exposing the substrate to a gas pulse comprising trisilylamine gas, where the exposing the substrate to the trisilylamine gas yields the nitrided high-k film that includes nitrogen and that is substantially free of silicon, and repeating the gas pulse sequence. A trisilylamine gas exposure may also be used to nitride a deposited high-k film.


Find Patent Forward Citations

Loading…