The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Feb. 24, 2011
Applicants:
Yuan-hung Liu, Hsinchu, TW;
Ku-feng Yang, Dali, TW;
Pei-ching Kuo, Hsinchu, TW;
Ming-tsu Chung, Hsinchu, TW;
Hsin-yu Chen, Taipei, TW;
Tsang-jiuh Wu, Hsinchu, TW;
Wen-chih Chiou, Miaoli, TW;
Inventors:
Yuan-Hung Liu, Hsinchu, TW;
Ku-Feng Yang, Dali, TW;
Pei-Ching Kuo, Hsinchu, TW;
Ming-Tsu Chung, Hsinchu, TW;
Hsin-Yu Chen, Taipei, TW;
Tsang-Jiuh Wu, Hsinchu, TW;
Wen-Chih Chiou, Miaoli, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 21/7682 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05009 (2013.01); H01L 2924/13091 (2013.01);
Abstract
An integrated circuit includes a substrate having a first surface and a second surface. At least one conductive structure continuously extends through the substrate. At least one sidewall of the at least one conductive structure is spaced from a sidewall of the substrate by an air gap.