The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Mar. 22, 2012
Hung-jen Lin, Tainan, TW;
Tsung-ding Wang, Tainan, TW;
Chien-hsiun Lee, Chu-tung Town, TW;
Wen-hsiung LU, Jhonghe, TW;
Ming-da Cheng, Jhubei, TW;
Chung-shi Liu, Hsinchu, TW;
Hung-Jen Lin, Tainan, TW;
Tsung-Ding Wang, Tainan, TW;
Chien-Hsiun Lee, Chu-tung Town, TW;
Wen-Hsiung Lu, Jhonghe, TW;
Ming-Da Cheng, Jhubei, TW;
Chung-Shi Liu, Hsinchu, TW;
Abstract
A package assembly including a semiconductor die electrically coupled to a substrate by an interconnected joint structure. The semiconductor die includes a bump overlying a semiconductor substrate, and a molding compound layer overlying the semiconductor substrate and being in physical contact with a first portion of the bump. The substrate includes a no-flow underfill layer on a conductive region. A second portion of the bump is in physical contact with the no-flow underfill layer to form the interconnected joint structure.