The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 2015

Filed:

Feb. 26, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jeffrey Drue David, San Jose, CA (US);

Benjamin Cherian, San Jose, CA (US);

Dominic J. Benvegnu, La Honda, CA (US);

Boguslaw A. Swedek, Cupertino, CA (US);

Thomas H. Osterheld, Mountain View, CA (US);

Jun Qian, Sunnyvale, CA (US);

Thomas Li, San Jose, CA (US);

Doyle E. Bennett, Santa Clara, CA (US);

David J. Lischka, San Jose, CA (US);

Steven M. Zuniga, Soquel, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2012.01); B24B 49/12 (2006.01); B24B 37/013 (2012.01);
U.S. Cl.
CPC ...
B24B 49/12 (2013.01); B24B 37/013 (2013.01);
Abstract

A method of operating a polishing system includes polishing a substrate at a polishing station, the substrate held by a carrier head during polishing, transporting the substrate to an in-sequence optical metrology system positioned between the polishing station and another polishing station or a transfer station, measuring a plurality of spectra reflected from the substrate with a probe of the optical metrology system while moving the carrier head to cause the probe to traverse a path across the substrate and while the probe remains stationary, the path across the substrate comprising either a plurality of concentric circles or a plurality of substantially radially aligned arcuate segments, and adjusting a polishing endpoint or a polishing parameter of the polishing system based on one or more characterizing values generated based on at least some of the plurality of spectra.


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