The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2015
Filed:
Jun. 05, 2012
Edmund Blackshear, Wappingers Falls, NY (US);
Thomas E. Lombardi, Poughkeepsie, NY (US);
Donald A. Merte, Poughkeepsie, NY (US);
Steven P. Ostrander, Poughkeepsie, NY (US);
Thomas Weiss, Poughkeepsie, NY (US);
Jiantao Zheng, Hopewell Junction, NY (US);
Edmund Blackshear, Wappingers Falls, NY (US);
Thomas E. Lombardi, Poughkeepsie, NY (US);
Donald A. Merte, Poughkeepsie, NY (US);
Steven P. Ostrander, Poughkeepsie, NY (US);
Thomas Weiss, Poughkeepsie, NY (US);
Jiantao Zheng, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method including providing a fixture comprising a trap ring, a base plate having a recess adapted to receive a laminate substrate, the base plate including an opening and an adjustable height center button disposed in the opening, the opening being located within the recess and located in a center of the laminate substrate, characterizing the laminate substrate for warpage characteristics by using one of room temperature techniques and elevated temperature techniques, determining a horizontal plane distortion based on the warpage characteristics, and placing the laminate substrate into the fixture with an adjustment to correct the horizontal plane distortion, the adjustment is provided by the adjustable height center button, wherein the adjustable height center button contacts the laminate substrate. The method further includes fluxing the laminate substrate, placing a chip onto the laminate substrate, and placing the fixture into a reflow furnace to join the chip and the laminate substrate.