The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Sep. 05, 2013
Applicant:

Suvolta, Inc., Los Gatos, CA (US);

Inventors:

Thomas Hoffmann, Los Gatos, CA (US);

Lucian Shifren, San Jose, CA (US);

Scott E. Thompson, Gainesville, FL (US);

Pushkar Ranade, Los Gatos, CA (US);

Jing Wang, San Jose, CA (US);

Paul E. Gregory, Palo Alto, CA (US);

Sachin R. Sonkusale, Los Gatos, CA (US);

Lance Scudder, Sunnyvale, CA (US);

Dalong Zhao, San Jose, CA (US);

Teymur Bakhishev, San Jose, CA (US);

Yujie Liu, San Jose, CA (US);

Lingquan Wang, Irvine, CA (US);

Weimin Zhang, San Jose, CA (US);

Sameer Pradhan, San Jose, CA (US);

Michael Duane, San Carlos, CA (US);

Sung Hwan Kim, San Jose, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/94 (2006.01); H01L 29/76 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7833 (2013.01); H01L 29/66545 (2013.01); H01L 29/7834 (2013.01); H01L 29/1083 (2013.01);
Abstract

A semiconductor transistor structure fabricated on a silicon substrate effective to set a threshold voltage, control short channel effects, and control against excessive junction leakage may include a transistor gate having a source and drain structure. A highly doped screening region lies is embedded a vertical distance down from the surface of the substrate. The highly doped screening region is separated from the surface of the substrate by way of a substantially undoped channel layer which may be epitaxially formed. The source/drain structure may include a source/drain extension region which may be raised above the surface of the substrate. The screening region is preferably positioned to be located at or just below the interface between the source/drain region and source/drain extension portion. The transistor gate may be formed below a surface level of the silicon substrate and either above or below the heavily doped portion of the source/drain structure.


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