The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 19, 2015

Filed:

Jun. 06, 2005
Applicants:

Mark Dishner, Lake Oswego, OR (US);

Chris W. Lee, Fremont, CA (US);

Sharon Mccauley, San Jose, CA (US);

Patrick Huet, San Jose, CA (US);

David Wang, Sunnyvale, CA (US);

Inventors:

Mark Dishner, Lake Oswego, OR (US);

Chris W. Lee, Fremont, CA (US);

Sharon McCauley, San Jose, CA (US);

Patrick Huet, San Jose, CA (US);

David Wang, Sunnyvale, CA (US);

Assignee:

KLA-Tencor Technologies Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01); G05B 23/02 (2006.01);
U.S. Cl.
CPC ...
G05B 23/0221 (2013.01);
Abstract

Computer-implemented methods for performing one or more defect-related functions are provided. One method for identifying noise in inspection data includes identifying events detected in a number of sets of inspection data that is less than a predetermined number as noise. One method for binning defects includes binning the defects into groups based on defect characteristics and the sets of the inspection data in which the defects were detected. One method for selecting defects for defect analysis includes binning defects into group(s) based on proximity of the defects to each other and spatial signatures formed by the group(s). A different method for selecting defects for defect analysis includes selecting defects having the greatest diversity of defect characteristic(s) for defect analysis. One method includes classifying defects on a specimen using inspection data generated for the specimen combined with defect review data generated for the specimen.


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