The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Oct. 01, 2009
Albrecht Uhlig, Berlin, DE;
Josef Gaida, Berlin, DE;
Christof Suchentrunk, Berlin, DE;
Michael Boyle, Rock Hill, SC (US);
Brian Washo, Fort Mill, SC (US);
Albrecht Uhlig, Berlin, DE;
Josef Gaida, Berlin, DE;
Christof Suchentrunk, Berlin, DE;
Michael Boyle, Rock Hill, SC (US);
Brian Washo, Fort Mill, SC (US);
Atotech Deutschland GmbH, Berlin, DE;
Abstract
The invention relates to a substrate having a bondable metal coating comprising, in this order, on an Al or Cu surface: (a) a Ni—P layer, (b) a Pd layer and, optionally, (c) an Au layer, wherein the thickness of the Ni—P layer (a) is 0.2 to 10 m, the thickness of the Pd layer (b) is 0.05 to 1.0 m and the thickness of the optional Au layer (c) is 0.01 to 0.5 m, and wherein the Ni—P layer (a) has a P content of 10.5 to 14 wt.-%. The deposit internal stress of the resulting Ni—P/Pd stack is not higher than 34.48M−Pa (5,000 psi). Further, a process for the preparation of such a substrate is described.