Brian Washo

Title: Brian Washo: Innovator in Bondable Wafer Surfaces

Introduction

Brian Washo is a notable inventor based in Fort Mill, SC (US). He has made significant contributions to the field of materials science, particularly in the development of bondable wafer surfaces. His innovative work has led to the creation of a patented technology that addresses internal stress in metal coatings.

Latest Patents

Brian Washo holds a patent for "Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces." This invention relates to a substrate with a bondable metal coating that includes a Ni-P layer, a Pd layer, and an optional Au layer. The specific thicknesses of these layers are crucial for ensuring the deposit internal stress of the resulting Ni-P/Pd stack does not exceed 34.48 MPa (5,000 psi). The Ni-P layer has a phosphorus content of 10.5 to 14 wt.-%, which is essential for the performance of the substrate.

Career Highlights

Brian Washo is currently employed at Atotech Deutschland GmbH, where he continues to advance his research and development efforts. His work focuses on improving the reliability and performance of electronic components through innovative material solutions.

Collaborations

Throughout his career, Brian has collaborated with esteemed colleagues such as Albrecht Uhlig and Josef Gaida. These partnerships have fostered a collaborative environment that enhances the innovation process.

Conclusion

Brian Washo's contributions to the field of bondable wafer surfaces exemplify the impact of innovative thinking in materials science. His patented technology not only addresses critical challenges but also paves the way for future advancements in the industry.