Berlin, Germany

Albrecht Uhlig


 

Average Co-Inventor Count = 2.9

ph-index = 5

Forward Citations = 71(Granted Patents)


Company Filing History:


Years Active: 1998-2015

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12 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Albrecht Uhlig

Introduction

Albrecht Uhlig is a prominent inventor based in Berlin, Germany. With an impressive portfolio of 12 patents, he has significantly contributed to the field of microelectronics through his innovative inventions. His work primarily focuses on improving bonding techniques and materials used in microelectronic devices.

Latest Patents

Albrecht Uhlig's latest patents showcase his expertise in creating advanced bonding materials. One notable invention is the "Wire bondable surface for microelectronic devices." This invention addresses the challenges of thin diffusion barriers in metal and metal alloy layers, specifically for wire bonding applications. The diffusion barrier selected from Co-M-P, Co-M-B, and Co-M-B—P alloys is crucial for ensuring reliable electronic connections.

Another significant patent is the "Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces." This invention describes a substrate featuring a bondable metal coating that includes a Ni-P layer, a Pd layer, and, optionally, an Au layer. The specifications detailed in this patent underline the importance of maintaining precise thicknesses and internal stress levels in these materials to enhance their performance.

Career Highlights

Albrecht Uhlig has an impressive professional background, having worked at several reputable companies. His experience includes positions at Samsung Mobile Display Co., Ltd. and Samsung SDI Co., Inc., where he honed his skills in microelectronics and material science.

Collaborations

Throughout his career, Uhlig has collaborated with talented professionals, including Thomas Schrader and Kerstin Nolte. These partnerships have enabled him to exchange ideas and push the boundaries of innovation in his field.

Conclusion

Albrecht Uhlig's contributions to microelectronics through his patents and collaborations firmly establish him as a leading inventor. His innovative approaches to wire bonding and substrate materials play a vital role in advancing technology and enhancing the performance of microelectronic devices. As he continues to innovate, the impact of his work will undoubtedly resonate throughout the industry.

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