Michael Boyle

Title: Michael Boyle - Innovator in Bondable Wafer Surfaces

Introduction

Michael Boyle is a notable inventor based in Rock Hill, SC (US). He has made significant contributions to the field of materials science, particularly in the development of bondable wafer surfaces. His innovative work has led to the creation of a patented technology that addresses internal stress in metal coatings.

Latest Patents

Michael Boyle holds a patent for "Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces." This invention relates to a substrate that features a bondable metal coating, which includes a Ni—P layer, a Pd layer, and an optional Au layer. The specific thicknesses of these layers are crucial for ensuring optimal performance, with the Ni—P layer having a thickness of 0.2 to 10 micrometers and a phosphorus content of 10.5 to 14 wt.-%. The resulting Ni—P/Pd stack maintains an internal stress not exceeding 34.48 MPa (5,000 psi), which is essential for the reliability of the substrate in various applications.

Career Highlights

Michael Boyle is currently employed at Atotech Deutschland GmbH, where he continues to advance his research and development efforts. His work focuses on improving the quality and performance of metal coatings used in semiconductor manufacturing and other high-tech industries.

Collaborations

Throughout his career, Michael has collaborated with esteemed colleagues such as Albrecht Uhlig and Josef Gaida. These partnerships have fostered innovation and have contributed to the successful development of new technologies in the field.

Conclusion

Michael Boyle's contributions to the field of bondable wafer surfaces exemplify the impact of innovative thinking in materials science. His patented technology not only enhances the performance of substrates but also sets a benchmark for future advancements in the industry.