The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Feb. 08, 2012
Ralf Otremba, Kaufbeuren, DE;
Fong Lim, Melaka, MY;
Abdul Rahman Mohamed, Muar, MY;
Chooi Mei Chong, Gopeng, MY;
Ida Fischbach, Munich, DE;
Xaver Schloegel, Sachsenkam, DE;
Juergen Schredl, Mering, DE;
Josef Hoeglauer, Kirchheim-Heimstetten, DE;
Ralf Otremba, Kaufbeuren, DE;
Fong Lim, Melaka, MY;
Abdul Rahman Mohamed, Muar, MY;
Chooi Mei Chong, Gopeng, MY;
Ida Fischbach, Munich, DE;
Xaver Schloegel, Sachsenkam, DE;
Juergen Schredl, Mering, DE;
Josef Hoeglauer, Kirchheim-Heimstetten, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. A first layer of solder material is provided between the first main surface and the carrier. A contact clip including a first contact area is placed on the semiconductor chip with the first contact area facing the second main surface of the semiconductor chip. A second layer of solder material is provided between the first contact area and the second main surface. Thereafter, heat is applied to the first and second layers of solder material to form diffusion solder bonds between the carrier, the semiconductor chip and the contact clip.