The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Jun. 28, 2013
Kyung Moon Kim, Seongnam, KR;
IL Kwon Shim, Singapore, SG;
Heejo Chi, Yeoju-gun, KR;
Hangil Shin, Seoul, KR;
Kyung Moon Kim, Seongnam, KR;
Il Kwon Shim, Singapore, SG;
HeeJo Chi, Yeoju-gun, KR;
HanGil Shin, Seoul, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
Methods of forming solder balls for semiconductor packages using film-assisted molding include providing a substrate, forming a plurality of solder balls on the substrate where each solder ball has an initial profile, and coupling a substantially planar film to the solder balls. As an encapsulation is deposited over the substrate and around the solder balls, the substantially planar film and the encapsulation, along with the molding process, can cause each solder ball to morph from its initial profile to a final profile, where the final profile is generally different from the initial profile.