The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Mar. 02, 2013
Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
Kla-tencor Corporation, Milpitas, CA (US);
Gino Marcuccilli, Glasgow, GB;
Amir Widmann, Sunnyvale, CA (US);
Ellis Chang, Saratoga, CA (US);
John Robinson, Austin, TX (US);
Allen Park, San Jose, CA (US);
KLA-Tencor Corp., Milpitas, CA (US);
Abstract
Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.