The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Sep. 30, 2011
Wen-yi Lin, New Taipei, TW;
Ming-chih Yew, Hsin-Chu, TW;
Po-yao Lin, Zhudong Township, TW;
Jing Ruei LU, Taipei, TW;
Jiun Yi Wu, Zhongli, TW;
Wen-Yi Lin, New Taipei, TW;
Ming-Chih Yew, Hsin-Chu, TW;
Po-Yao Lin, Zhudong Township, TW;
Jing Ruei Lu, Taipei, TW;
Jiun Yi Wu, Zhongli, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the first and second packages. The first package has a first substrate and through vias through the first substrate. A first set of conductive elements is aligned with and coupled to the through vias of the first substrate. A solid thermal coupler is coupled to the first set of conductive elements and to a die of the second package. A second set of conductive elements is coupled to the die and a bottom substrate is coupled to the second set of conductive elements. The thermal coupler may be, e.g., an interposer, a heat spreader, or a thermal conductive layer.