The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Dec. 18, 2013
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Ramesh Chandrasekharan, Tualatin, OR (US);

Adrien Lavoie, Newberg, OR (US);

Damien Slevin, Salem, OR (US);

Karl Leeser, West Linn, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); C23C 16/00 (2006.01); H01L 21/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0228 (2013.01); H01L 21/67207 (2013.01); H01L 21/02164 (2013.01); H01L 21/022 (2013.01); H01L 21/02208 (2013.01); H01L 21/02274 (2013.01);
Abstract

Disclosed herein are methods of depositing layers of material on multiple semiconductor substrates at multiple processing stations within one or more reaction chambers. The methods may include dosing a first substrate with film precursor at a first processing station and dosing a second substrate with film precursor at a second processing station with precursor flowing from a common source, wherein the timing of said dosing is staggered such that the first substrate is dosed during a first dosing phase during which the second substrate is not substantially dosed, and the second substrate is dosed during a second dosing phase during which the first substrate is not substantially dosed. Also disclosed herein are apparatuses having a plurality of processing stations contained within one or more reaction chambers and a controller with machine-readable instructions for staggering the dosing of first and second substrates at first and second processing stations.

Published as:
US2015017812A1; KR20150008015A; US8940646B1; US2015099372A1; TW201516174A; US9236244B2; TWI614363B; KR102296320B1; KR20210108346A; KR102409456B1; KR20220084002A; KR102498418B1;

Find Patent Forward Citations

Loading…