The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Mar. 11, 2013
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Juergen Reich, Campbell, CA (US);

Aleksey Petrenko, Milpitas, CA (US);

Richard Fong, Sunnyvale, CA (US);

Bret Whiteside, Gilroy, CA (US);

Jien Cao, Fremont, CA (US);

Christian Wolters, Campbell, CA (US);

Anatoly Romanovsky, Palo Alto, CA (US);

Daniel Kavaldjiev, San Jose, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01J 1/00 (2006.01); H01L 21/67 (2006.01); G01J 1/42 (2006.01);
U.S. Cl.
CPC ...
G01J 1/4257 (2013.01);
Abstract

Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.


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