The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Nov. 15, 2011
Applicants:

Takashi Aigo, Tokyo, JP;

Hiroshi Tsuge, Tokyo, JP;

Masakazu Katsuno, Tokyo, JP;

Tatsuo Fujimoto, Tokyo, JP;

Hirokatsu Yashiro, Tokyo, JP;

Inventors:

Takashi Aigo, Tokyo, JP;

Hiroshi Tsuge, Tokyo, JP;

Masakazu Katsuno, Tokyo, JP;

Tatsuo Fujimoto, Tokyo, JP;

Hirokatsu Yashiro, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/02 (2006.01); C30B 25/18 (2006.01); C30B 29/36 (2006.01); C30B 25/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02378 (2013.01); C30B 25/18 (2013.01); H01L 21/02529 (2013.01); H01L 21/02433 (2013.01); C30B 25/186 (2013.01); H01L 21/0262 (2013.01); C30B 29/36 (2013.01); H01L 21/02658 (2013.01); C30B 25/02 (2013.01); Y10S 438/931 (2013.01);
Abstract

An object of the present invention is to provide a production process of an epitaxial silicon carbide single crystal substrate having a high-quality silicon carbide single crystal thin film reduced in the surface defect and the like on a silicon carbide single crystal substrate with a small off-angle. According to the present invention, in the production process of an epitaxial silicon carbide single crystal substrate having a high-quality silicon carbide single crystal thin film reduced in the surface defect and the like on a silicon carbide single crystal substrate with an off-angle of 4° or less, pretreatment etching to a depth of 0.1 to 1 μm is performed at a temperature of 1,550 to 1,650° C. by flowing a gas containing silicon and chlorine together with a hydrogen gas such that the silicon atom concentration becomes from 0.0001 to 0.01% based on hydrogen atoms in the hydrogen gas, and thereafter, an epitaxial layer is formed.


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