The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8906809 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 09, 2014

Filed:

Jun. 07, 2012
Applicants:

Martin M. Beaumier, Quebec, CA;

Steven P. Ostrander, Hopewell Junction, NY (US);

Kamal K. Sikka, Hopewell Junction, NY (US);

Hilton T. Toy, Hopewell Junction, NY (US);

Jeffrey A. Zitz, Hopewell Junction, NY (US);

Inventors:

Martin M. Beaumier, Quebec, CA;

Steven P. Ostrander, Hopewell Junction, NY (US);

Kamal K. Sikka, Hopewell Junction, NY (US);

Hilton T. Toy, Hopewell Junction, NY (US);

Jeffrey A. Zitz, Hopewell Junction, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); H01L 23/42 (2006.01); H01L 23/10 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4338 (2013.01); H01L 23/42 (2013.01); H01L 23/10 (2013.01);
Abstract

A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.


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