The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Dec. 09, 2010
Ping-yin Liu, Yonghe, TW;
Li-cheng Chu, Taipei, TW;
Hung-hua Lin, Taipei, TW;
Shang-ying Tsai, Pingzhen, TW;
Yuan-chih Hsieh, Hsinchu, TW;
Jung-huei Peng, Jhubei, TW;
Lan-lin Chao, Sindian, TW;
Chia-shiung Tsai, Hsin-Chu, TW;
Chun-wen Cheng, Zhubei, TW;
Ping-Yin Liu, Yonghe, TW;
Li-Cheng Chu, Taipei, TW;
Hung-Hua Lin, Taipei, TW;
Shang-Ying Tsai, Pingzhen, TW;
Yuan-Chih Hsieh, Hsinchu, TW;
Jung-Huei Peng, Jhubei, TW;
Lan-Lin Chao, Sindian, TW;
Chia-Shiung Tsai, Hsin-Chu, TW;
Chun-Wen Cheng, Zhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.