The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Aug. 16, 2010
Martin M. Beaumier, Quebec, CA;
Steven P. Ostrander, Hopewell Junction, NY (US);
Kamal K. Sikka, Hopewell Junction, NY (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Jeffrey A. Zitz, Hopewell Junction, NY (US);
Martin M. Beaumier, Quebec, CA;
Steven P. Ostrander, Hopewell Junction, NY (US);
Kamal K. Sikka, Hopewell Junction, NY (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Jeffrey A. Zitz, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further includes separating the lid and the chip carrier and placing at least one seal shim on one of the lid and chip carrier. The at least one seal shim has a thickness that results in a gap between the pistons with the respective ones of the chips on the chip carrier. The method further includes dispensing thermal interface material within the gap and in contact with the chips. The method further includes sealing the lid to the chip carrier with the at least one seal shim between the lid and the chip carrier.