The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Dec. 10, 2010
Applicants:

Debabrata Gupta, Scottsdale, AZ (US);

Yukio Hashimoto, Hitachinaka, JP;

Ilyas Mohammed, Santa Clara, CA (US);

Laura Mirkarimi, Sunol, CA (US);

Rajesh Katkar, San Jose, CA (US);

Inventors:

Debabrata Gupta, Scottsdale, AZ (US);

Yukio Hashimoto, Hitachinaka, JP;

Ilyas Mohammed, Santa Clara, CA (US);

Laura Mirkarimi, Sunol, CA (US);

Rajesh Katkar, San Jose, CA (US);

Assignee:

Tessera, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 2225/06517 (2013.01); H01L 2224/81193 (2013.01); H01L 25/105 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/15321 (2013.01); H01L 2224/73265 (2013.01); H01L 23/49833 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/131 (2013.01); H01L 2225/1023 (2013.01); H01L 24/81 (2013.01); H01L 24/16 (2013.01); H01L 2224/32225 (2013.01); H01L 24/73 (2013.01); H01L 2225/0652 (2013.01); H01L 2924/15311 (2013.01); H01L 24/13 (2013.01); H01L 24/32 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15331 (2013.01); H01L 24/48 (2013.01);
Abstract

A microelectronic assembly includes a first surface and a first thin conductive element exposed at the first surface and having a face comprising first and second regions. A first conductive projection having a base connected to and covering the first region of the face extends to an end remote from the base. A first dielectric material layer covers the second region of the first thin element and contacts at least the base of the first conductive projection. The assembly further includes a second substrate having a second face and a second conductive projection extending away from the second face. A first fusible metal mass connects the first projection to the second projection and extends along an edge of the first projection towards the first dielectric material layer.


Find Patent Forward Citations

Loading…