The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Mar. 14, 2013
Taiwan Semiconductor Manufactuing Company, Ltd., Hsin-Chu, TW;
Tsung-Shu Lin, New Taipei, TW;
Cheng-Chieh Hsieh, Yongkang District, TW;
Hung-An Teng, Taoyuan, TW;
Sao-Ling Chiu, Hsin-Chu, TW;
Shang-Yun Hou, Jubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Methods and apparatus are disclosed for forming ultra-thin packages for semiconductor devices on flexible substrates. A flexible substrate may comprise a plurality of insulating layers and redistribution layers. Openings of the flexible substrate may be formed at one side of the flexible substrate, two sides of the flexible substrate, or simply cut through the flexible substrate to divide the flexible substrate into two parts. Connectors may be placed within the opening of the flexible substrate and connected to redistribution layers of the flexible substrate. Dies can be attached to the connectors and electrically connected to the connectors and to the redistribution layers of the flexible substrate. Structure supports may be placed at another side of the flexible substrate on the surface or within an opening.