The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Sep. 10, 2009
Applicants:

Steven W. Meeks, Fremont, CA (US);

Xiaoqian Xu, San Jose, CA (US);

Hung P. Nguyen, Santa Clara, CA (US);

Alireza Shahdoost Moghadam, San Jose, CA (US);

Mahendra Prabhu Ramachandran, Palo Alto, CA (US);

Inventors:

Steven W. Meeks, Fremont, CA (US);

Xiaoqian Xu, San Jose, CA (US);

Hung P. Nguyen, Santa Clara, CA (US);

Alireza Shahdoost Moghadam, San Jose, CA (US);

Mahendra Prabhu Ramachandran, Palo Alto, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system to detect and classify defects on a surface of a substrate. A first targeting assembly directs radiation in a first beam onto the substrate. A first collecting assembly collects first radiation specularly reflected from the substrate and produces first signals, a second collecting assembly collects first radiation scattered from the surface of the substrate by defects and not micro-roughness and produces second signals, and a third collecting assembly collects first radiation scattered from the surface of the substrate by defects and micro-roughness and produces third signals. A second targeting assembly directs radiation in a second beam onto the substrate. A fourth collecting assembly collects second radiation scattered from the substrate and produces fourth signals. A processor receives the first, second, third, and fourth signals. A module coupled to the processor has logic instructions stored in a computer-readable medium, which configure the processor to analyze the signals to detect and classify the defects on the substrate.


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Quick Actions:

Meeks, Steven. (2014). Detecting and classifying surface defects with multiple radiation collectors (U.S. Patent No. 8823935). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8823935

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