The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8822306 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 02, 2014

Filed:

Aug. 09, 2011
Applicants:

Rudolf Berger, Regensburg, DE;

Hermann Gruber, Woerth a.D., DE;

Wolfgang Lehnert, Lintach, DE;

Guenther Ruhl, Regensburg, DE;

Raimund Foerg, Straubing, DE;

Anton Mauder, Kolbermoor, DE;

Hans-joachim Schulze, Taufkirchen, DE;

Karsten Kellermann, Altdorf, DE;

Michael Sommer, Nuremberg, DE;

Christian Rottmair, Erlangen, DE;

Roland Rupp, Lauf, DE;

Inventors:

Rudolf Berger, Regensburg, DE;

Hermann Gruber, Woerth a.D., DE;

Wolfgang Lehnert, Lintach, DE;

Guenther Ruhl, Regensburg, DE;

Raimund Foerg, Straubing, DE;

Anton Mauder, Kolbermoor, DE;

Hans-Joachim Schulze, Taufkirchen, DE;

Karsten Kellermann, Altdorf, DE;

Michael Sommer, Nuremberg, DE;

Christian Rottmair, Erlangen, DE;

Roland Rupp, Lauf, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to an embodiment, a composite wafer includes a carrier substrate having a graphite layer and a monocrystalline semiconductor layer attached to the carrier substrate.


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