The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2014
Filed:
Feb. 12, 2010
Tomohiro Uno, Tokyo, JP;
Shinichi Terashima, Tokyo, JP;
Takashi Yamada, Iruma, JP;
Ryo Oishi, Iruma, JP;
Daizo Oda, Iruma, JP;
Tomohiro Uno, Tokyo, JP;
Shinichi Terashima, Tokyo, JP;
Takashi Yamada, Iruma, JP;
Ryo Oishi, Iruma, JP;
Daizo Oda, Iruma, JP;
Nippon Steel & Sumikin Materials., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Abstract
It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %.