The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8804112 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 12, 2014

Filed:

Apr. 22, 2010
Applicants:

Yukihiro Shibata, Fujisawa, JP;

Toshihiko Nakata, Hiratsuka, JP;

Taketo Ueno, Kawasaki, JP;

Atsushi Taniguchi, Fujisawa, JP;

Toshifumi Honda, Yokohama, JP;

Inventors:

Yukihiro Shibata, Fujisawa, JP;

Toshihiko Nakata, Hiratsuka, JP;

Taketo Ueno, Kawasaki, JP;

Atsushi Taniguchi, Fujisawa, JP;

Toshifumi Honda, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laserand an incoherent illumination of LEDsand, and light paths are divided in a detecting system corresponding to respective illumination light, spatial modulation elementsandare arranged to detecting light paths, respectively, scattered light inhibiting sensitivity is shielded by the spatial modulating elementsand, scattered light transmitted through the spatial modulation elementsandis detected by image sensorsandarranged to respective light paths, and images detected by these two image sensorsandare subjected to a comparison processing, thereby determining a defect candidate.


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