The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Feb. 11, 2011
Wei-cheng Wu, Hsinchu, TW;
Hsien-pin HU, Zhubei, TW;
Shang-yun Hou, Jubei, TW;
Shin-puu Jeng, Hsinchu, TW;
Chen-hua Yu, Hsinchu, TW;
Chao-hsiang Yang, Hsinchu, TW;
Wei-Cheng Wu, Hsinchu, TW;
Hsien-Pin Hu, Zhubei, TW;
Shang-Yun Hou, Jubei, TW;
Shin-Puu Jeng, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Chao-Hsiang Yang, Hsinchu, TW;
Abstract
Test structures for performing electrical tests of devices under one or more microbumps are provided. Each test structure includes at least one microbump pad and a test pad. The microbump pad is a part of a metal pad connected to an interconnect for a device. A width of the microbump pad is equal to or less than about 50 μm. The test pad is connected to the at least one microbump pad. The test pad has a size large enough to allow circuit probing of the device. The test pad is another part of the metal pad. A width of the test pad is greater than the at least one microbump pad.