The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 03, 2014
Filed:
Jul. 16, 2010
Shinichi Terashima, Tokyo, JP;
Tomohiro Uno, Tokyo, JP;
Takashi Yamada, Saitama, JP;
Daizo Oda, Saitama, JP;
Shinichi Terashima, Tokyo, JP;
Tomohiro Uno, Tokyo, JP;
Takashi Yamada, Saitama, JP;
Daizo Oda, Saitama, JP;
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Abstract
A bonding wire for semiconductor includes: a core wire of copper or a copper alloy; a coating layer containing palladium and having a thickness of 10 to 200 nm; and an alloy layer formed on a surface of the coating layer. The alloy layer contains a noble metal and palladium and having a thickness of 1 to 80 nm. The noble metal is either gold or silver, and a concentration of the noble metal in the alloy layer is not less than 10% and not more than 75% by volume.