The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
Jun. 19, 2012
Yisu Park, Icheon-si, KR;
Kyunghoon Lee, Icheon, KR;
Joungln Yang, Seoul, KR;
Sangmi Park, Pucheon-Si, KR;
Daesik Choi, Seoul, KR;
YiSu Park, Icheon-si, KR;
KyungHoon Lee, Icheon, KR;
Joungln Yang, Seoul, KR;
SangMi Park, Pucheon-Si, KR;
DaeSik Choi, Seoul, KR;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes providing a substrate; connecting an integrated circuit die; forming a molding having a temperature-dependent characteristic directly on the top surface of the substrate; and forming a coupling encapsulation having a coupled characteristic different from the temperature-dependent characteristic directly on the molding forms an encapsulation boundary between the coupling encapsulation and the molding.