Koyang-si, South Korea

Joungln Yang


Average Co-Inventor Count = 2.9

ph-index = 1

Forward Citations = 8(Granted Patents)


Location History:

  • Koyang-si, KR (2011 - 2012)
  • Seoul, KR (2014)

Company Filing History:


Years Active: 2011-2014

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Joungln Yang: Innovator in Integrated Circuit Packaging

Introduction

Joungln Yang is a prominent inventor based in Koyang-si, South Korea. He has made significant contributions to the field of integrated circuit packaging, holding a total of 3 patents. His innovative work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

One of his latest patents is titled "Integrated circuit packaging system having warpage prevention structures." This patent describes a method of manufacturing an integrated circuit packaging system that includes providing a substrate, connecting an integrated circuit die, and forming a molding with a temperature-dependent characteristic directly on the substrate. Additionally, it involves creating a coupling encapsulation with a different characteristic to form an encapsulation boundary.

Another notable patent is "Package-on-package system with through vias and method of manufacture thereof." This invention outlines a method for manufacturing a package-on-package system, which includes providing a package substrate, attaching a semiconductor die, and forming an encapsulant around the die. The encapsulant features through openings that allow for the creation of through vias, enhancing the overall functionality of the package.

Career Highlights

Joungln Yang is currently employed at Stats Chippac Pte. Ltd., where he continues to innovate in the semiconductor packaging industry. His work has been instrumental in advancing technologies that improve the efficiency and reliability of electronic devices.

Collaborations

Throughout his career, Joungln has collaborated with talented individuals such as DongSam Park and YiSu Park. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Joungln Yang is a key figure in the field of integrated circuit packaging, with a focus on innovative solutions that address industry challenges. His contributions through his patents reflect his commitment to advancing technology in the semiconductor sector.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…