The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Aug. 16, 2005
Applicants:

Samuel Leung, San Jose, CA (US);

Su Ho Cho, Saratoga, CA (US);

William Allan Bagley, Tokyo, JP;

Inventors:

Samuel Leung, San Jose, CA (US);

Su Ho Cho, Saratoga, CA (US);

William Allan Bagley, Tokyo, JP;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/458 (2006.01); C23C 16/46 (2006.01); H01L 21/306 (2006.01); H01L 21/3065 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 16/463 (2013.01); C23C 16/46 (2013.01); C23C 16/4586 (2013.01); C23C 16/4583 (2013.01); C23C 16/4582 (2013.01); C23C 16/458 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01L 21/67069 (2013.01); H01L 21/67103 (2013.01);
Abstract

A substrate support assembly and method for controlling the temperature of a substrate within a process chamber with a temperature uniformity of +/−5° C. are provided. A substrate support assembly includes a thermally conductive body comprising an aluminum material, a substrate support surface on the surface of the thermally conductive body and adapted to support the large area glass substrate thereon, one or more heating elements embedded within the thermally conductive body, and one or more cooling channels embedded within the thermally conductive body and positioned around the one or more heating elements. A process chamber comprising the substrate support assembly of the invention is also provided.

Published as:
US2007039942A1; KR20070021077A; CN1919768A; JP2007053382A; TW200709256A; TWI338319B; CN1919768B; KR101312676B1; US8709162B2; JP5484650B2;

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