Samuel Leung

Title: Innovations of Samuel Leung in Active Cooling Technology

Introduction

Samuel Leung is an accomplished inventor based in San Jose, California. He has made significant contributions to the field of substrate support technology, particularly in the area of active cooling systems. His innovative approach has led to advancements that enhance temperature control within process chambers.

Latest Patents

Samuel Leung holds a patent for an "Active Cooling Substrate Support." This invention provides a substrate support assembly and method for controlling the temperature of a substrate within a process chamber, achieving a temperature uniformity of +/−5°C. The assembly features a thermally conductive body made from aluminum, a substrate support surface designed for large area glass substrates, embedded heating elements, and cooling channels strategically positioned around the heating elements.

Career Highlights

Leung is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display technology sectors. His work focuses on developing innovative solutions that improve manufacturing processes and product quality. With a patent portfolio that includes 1 patent, he continues to push the boundaries of technology in his field.

Collaborations

Throughout his career, Samuel has collaborated with notable colleagues, including Su Ho Cho and William Allan Bagley. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Samuel Leung's contributions to active cooling technology exemplify the impact of innovative thinking in the semiconductor industry. His work not only enhances temperature control in manufacturing processes but also sets the stage for future advancements in substrate support systems.