The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Jan. 24, 2006
Zigmund Ramirez Camacho, Singapore, SG;
Jose Alvin Caparas, Singapore, SG;
Arnel Trasporto, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
Jose Alvin Caparas, Singapore, SG;
Arnel Trasporto, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
An integrated circuit package system provides a known good die module by providing a leadframe, providing a first die, attaching the first die to the leadframe, and encapsulating at least the first die. A second die is attached to the known good die module such that the known good die module is a substrate for the second die. The second die is electrically attached to the known good die module. At least the second die is additionally encapsulated.