The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Apr. 04, 2007
Mitsuo Tada, Tokyo, JP;
Taro Takahashi, Tokyo, JP;
Motohiro Niijima, Tokyo, JP;
Shinro Ohta, Tokyo, JP;
Atsushi Shigeta, Fujisawa, JP;
Mitsuo Tada, Tokyo, JP;
Taro Takahashi, Tokyo, JP;
Motohiro Niijima, Tokyo, JP;
Shinro Ohta, Tokyo, JP;
Atsushi Shigeta, Fujisawa, JP;
Ebara Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A polishing apparatus is used for polishing and planarizing a substrate such as a semiconductor wafer on which a conductive film such as a copper (Cu) layer or a tungsten (W) layer is formed. The polishing apparatus includes a polishing table having a polishing surface, a motor for rotating the polishing table, a top ring for holding a substrate and pressing the substrate against the polishing surface, a film thickness measuring sensor disposed in the polishing table for scanning a surface of the substrate, and a computing device for processing signals of the film thickness measuring sensor to compute a film thickness of the substrate.