The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2014
Filed:
Nov. 21, 2011
Rajinder Dhindsa, San Jose, CA (US);
Alexei Marakhtanov, Albany, CA (US);
Gerardo Delgadino, Santa Clara, CA (US);
Eric Hudson, Berkeley, CA (US);
BI Ming Yen, Fremont, CA (US);
Andrew D. Bailey, Iii, Pleasanton, CA (US);
Rajinder Dhindsa, San Jose, CA (US);
Alexei Marakhtanov, Albany, CA (US);
Gerardo Delgadino, Santa Clara, CA (US);
Eric Hudson, Berkeley, CA (US);
Bi Ming Yen, Fremont, CA (US);
Andrew D. Bailey, III, Pleasanton, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
Methods, systems, and computer programs are presented for semiconductor manufacturing are provided. One wafer processing apparatus includes: a top electrode; a bottom electrode; a first radio frequency (RF) power source; a second RF power source; a third RF power source; a fourth RF power source; and a switch. The first, second, and third power sources are coupled to the bottom electrode. Further, the switch is operable to be in one of a first position or a second position, where the first position causes the top electrode to be connected to ground, and the second position causes the top electrode to be connected to the fourth RF power source.