The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2014
Filed:
Jan. 23, 2006
Applicants:
Zigmund Ramirez Camacho, Singapore, SG;
Henry D. Bathan, Singapore, SG;
Arnel Trasporto, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
Inventors:
Zigmund Ramirez Camacho, Singapore, SG;
Henry D. Bathan, Singapore, SG;
Arnel Trasporto, Singapore, SG;
Jeffrey D. Punzalan, Singapore, SG;
Assignee:
Stats Chippac Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports.
Camacho, Zigmund. (2014). Padless die support integrated circuit package system (U.S. Patent No. 8629537). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8629537
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile