The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2013

Filed:

May. 02, 2011
Applicants:

Rita J. Klein, Boise, ID (US);

Dale W. Collins, Boise, ID (US);

Paul Morgan, Kuna, ID (US);

Joseph N. Greeley, Boise, ID (US);

Nishant Sinha, Boise, ID (US);

Inventors:

Rita J. Klein, Boise, ID (US);

Dale W. Collins, Boise, ID (US);

Paul Morgan, Kuna, ID (US);

Joseph N. Greeley, Boise, ID (US);

Nishant Sinha, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electrolyte solution, methods, and systems for selectively removing a conductive metal from a substrate are provided. The electrolyte solution comprising nanoparticles that are more noble than the conductive metal being removed, is applied to a substrate to remove the conductive metal selectively relative to a dielectric material without application of an external potential or contact of a processing pad with a surface of the substrate. The solutions and methods can be applied, for example, to remove a conductive metal layer (e.g., barrier metal) selectively relative to a dielectric material and to a materially different conductive metal (e.g., copper interconnect) without application of an external potential or contact of a processing pad with the surface of the substrate.


Find Patent Forward Citations

Loading…