The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2013

Filed:

Sep. 13, 2012
Applicants:

Dingying Xu, Maricopa, AZ (US);

Leonel R. Arana, Phoenix, AZ (US);

Nachiket R. Raravikar, Gilbert, AZ (US);

Mohit Mamodia, Chandler, AZ (US);

Rajasekaran Swaminathan, Tempe, AZ (US);

Rahul Manepalli, Chandler, AZ (US);

Inventors:

Dingying Xu, Maricopa, AZ (US);

Leonel R. Arana, Phoenix, AZ (US);

Nachiket R. Raravikar, Gilbert, AZ (US);

Mohit Mamodia, Chandler, AZ (US);

Rajasekaran Swaminathan, Tempe, AZ (US);

Rahul Manepalli, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); B32B 27/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A coating for a microelectronic device comprises a polymer film () containing a filler material (). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness () that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape () to form a treatment () that simplifies a manufacturing process for a microelectronic package () and may be used in order to manage a thermal profile of the microelectronic device.


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