The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Dec. 27, 2007
Applicants:
Zigmund Ramirez Camacho, Singapore, SG;
Lionel Chien Hui Tay, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Inventors:
Zigmund Ramirez Camacho, Singapore, SG;
Lionel Chien Hui Tay, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit package system including: forming a die pad, wherein the die pad has a tiebar at a corner; forming a lead wherein the lead is connected to the tiebar; connecting an integrated circuit die to the die pad; and forming an encapsulation, having an edge, over the integrated circuit die with the lead extending from and beyond the edge.