The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2013
Filed:
Dec. 08, 2010
Timothy H. Daubenspeck, Colchester, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Ekta Misra, Fishkill, NY (US);
Christopher D. Muzzy, Burlington, VT (US);
Wolfgang Sauter, Hinesburg, VT (US);
George J. Scott, Wappingers Falls, NY (US);
Timothy H. Daubenspeck, Colchester, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
Ekta Misra, Fishkill, NY (US);
Christopher D. Muzzy, Burlington, VT (US);
Wolfgang Sauter, Hinesburg, VT (US);
George J. Scott, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Solder bump connections and methods for fabricating solder bump connections. The method includes forming a layer stack containing first and second conductive layers, forming a dielectric passivation layer on a top surface of the second conductive layer, and forming a via opening extending through the dielectric passivation layer to the top surface of the second conductive layer. The method further includes forming a conductive plug in the via opening. The solder bump connection includes first and second conductive layers comprised of different conductors, a dielectric passivation layer on a top surface of the second conductive layer, a via opening extending through the dielectric passivation layer to the top surface of the second conductive layer, and a conductive plug in the via opening.