The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8431475 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 30, 2013

Filed:

Aug. 31, 2007
Applicants:

Fengyi Jiang, Nanchang, CN;

LI Wang, Jiang Xi, CN;

Wenqing Fang, Jiang Xi, CN;

Chunlan MO, Jiang Xi, CN;

Inventors:

Fengyi Jiang, Nanchang, CN;

Li Wang, Jiang Xi, CN;

Wenqing Fang, Jiang Xi, CN;

Chunlan Mo, Jiang Xi, CN;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/40 (2010.01);
U.S. Cl.
CPC ...
Abstract

One embodiment of the present invention provides a method for fabricating a group III-V nitride structure with an ohmic-contact layer. The method involves fabricating a group III-V nitride structure with a p-type layer. The method further involves depositing an ohmic-contact layer on the p-type layer without first annealing the p-type layer. The method also involves subsequently annealing the p-type layer and the ohmic-contact layer in an annealing chamber at a predetermined temperature for a predetermined period of time, thereby reducing the resistivity of the p-type layer and the ohmic contact in a single annealing process.


Find Patent Forward Citations

Jiang, Fengyi. (2013). Method for fabricating a low-resistivity ohmic contact to a p-type iii-v nitride semiconductor material at low temperature (U.S. Patent No. 8431475). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8431475

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