The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2013
Filed:
Mar. 23, 2007
Keiichi Kimura, Futtsu, JP;
Tomohiro Uno, Futtsu, JP;
Takashi Yamada, Iruma, JP;
Kagehito Nishibayashi, Iruma, JP;
Keiichi Kimura, Futtsu, JP;
Tomohiro Uno, Futtsu, JP;
Takashi Yamada, Iruma, JP;
Kagehito Nishibayashi, Iruma, JP;
Nippon Steel & Sumikin Materials Co., Ltd., Tokyo, JP;
Nippon Micrometal Corporation, Saitama, JP;
Abstract
A gold wire for semiconductor element connection having high strength and bondability. The connection has a limited amount of at least one element selected from calcium and rare earth elements, and a limited amount of at least one element selected from a group consisting of titanium, vanadium, chromium, hafnium, niobium, tungsten, and zirconium. The incorporation of a suitable amount of palladium or beryllium is preferred. The incorporation of calcium and rare earth element can improve the strength and young's modulus of a gold wire, and the incorporation of titanium and the like can reduce a deterioration in the roundness of press-bonded shape of press-bonded balls in the first bonding caused by the incorporation of calcium and rare earth elements. The bonding wire can simultaneously realize mechanical properties and bondability capable of meeting a demand for a size reduction in semiconductor and a reduction in electrode pad pitch.