The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2013
Filed:
Feb. 09, 2009
Makoto Fukushima, Tokyo, JP;
Tetsuji Togawa, Tokyo, JP;
Hozumi Yasuda, Tokyo, JP;
Koji Saito, Tokyo, JP;
Osamu Nabeya, Tokyo, JP;
Tomoshi Inoue, Tokyo, JP;
Makoto Fukushima, Tokyo, JP;
Tetsuji Togawa, Tokyo, JP;
Hozumi Yasuda, Tokyo, JP;
Koji Saito, Tokyo, JP;
Osamu Nabeya, Tokyo, JP;
Tomoshi Inoue, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table () having a polishing surface (), a top ring body () configured to hold and press a substrate against the polishing surface (), and a retainer ring () provided at an outer peripheral portion of the top ring body () and configured to press the polishing surface (). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring () during polishing of the substrate is located above a central portion of the substrate.