The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2013
Filed:
Jan. 20, 2012
Sriram Dattaguru, Chandler, AZ (US);
Lesley A. Polka Wood, Chandler, AZ (US);
Yoshihiro Tomita, Tsukuba, JP;
Kiniya Ichikawa, Tsukuba, JP;
Robert L. Sankman, Phoenix, AZ (US);
Sriram Dattaguru, Chandler, AZ (US);
Lesley A. Polka Wood, Chandler, AZ (US);
Yoshihiro Tomita, Tsukuba, JP;
Kiniya Ichikawa, Tsukuba, JP;
Robert L. Sankman, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate. The microelectronic die is coupled to the processor interconnect and communication between a processor to be installed on the processor footprint is in a rate between 10 Gb/s and 1 Tb/s.