Company Filing History:
Years Active: 2013
Title: Kiniya Ichikawa: Innovator in Microelectronic Technology
Introduction
Kiniya Ichikawa is a notable inventor based in Tsukuba, Japan. He has made significant contributions to the field of microelectronics, particularly through his innovative patent that enhances the performance of microelectronic apparatuses. His work is instrumental in advancing technology that supports high-speed data communication.
Latest Patents
Kiniya Ichikawa holds a patent for an "In-package microelectronic apparatus, and methods of using same." This invention features a mounting substrate for a processor that includes a die side and a land side, with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect, and a microelectronic die is embedded in the mounting substrate. This design allows for communication between a processor to be installed on the processor footprint at rates between 10 Gb/s and 1 Tb/s. He has 1 patent to his name.
Career Highlights
Kiniya Ichikawa is currently employed at Intel Corporation, a leading company in the technology sector. His role involves developing cutting-edge microelectronic solutions that push the boundaries of current technology. His expertise in this area has positioned him as a key player in the advancement of microelectronic systems.
Collaborations
Throughout his career, Kiniya has collaborated with talented individuals such as Sriram Dattaguru and Lesley A Polka Wood. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion
Kiniya Ichikawa's contributions to microelectronic technology are noteworthy and reflect his dedication to innovation. His patent and work at Intel Corporation highlight his role in shaping the future of high-speed data communication.