The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2012
Filed:
Oct. 05, 2007
Yoshiki Hishiro, Boise, ID (US);
Scott Sills, Boise, ID (US);
Hiroyuki Mori, Boise, ID (US);
Troy Gugel, Boise, ID (US);
Paul D. Shirley, Meridian, ID (US);
Lijing Gou, Boise, ID (US);
Adam Olson, Boise, ID (US);
Yoshiki Hishiro, Boise, ID (US);
Scott Sills, Boise, ID (US);
Hiroyuki Mori, Boise, ID (US);
Troy Gugel, Boise, ID (US);
Paul D. Shirley, Meridian, ID (US);
Lijing Gou, Boise, ID (US);
Adam Olson, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method of lithographically patterning a substrate that has photoresist having removal areas and non-removal areas includes first exposing at least the non-removal areas to radiation effective to increase outer surface roughness of the photoresist in the non-removal areas at least post-develop but ineffective to change photoresist solubility in a developer for the photoresist to be cleared from the non-removal areas upon develop with the developer. Second exposing of radiation to the removal areas is conducted to be effective to change photoresist solubility in the developer for the photoresist to be cleared from the removal areas upon develop with the developer. The photoresist is developed with the developer effective to clear photoresist from the removal areas and to leave photoresist in the non-removal areas that has outer surface roughness in the non-removal areas which is greater than that before the first exposing. Other implementations and embodiments are contemplated.