The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2012
Filed:
Mar. 19, 2003
Katsuo Sakai, Tokyo, JP;
Seiji Okura, Tokyo, JP;
Masaji Sakamura, Tokyo, JP;
Kaoru Abe, Tokyo, JP;
Hitoshi Murata, Tokyo, JP;
Etsuo Wani, Tokyo, JP;
Kenji Kameda, Tokyo, JP;
Yuki Mitsui, Tokyo, JP;
Yutaka Ohira, Tokyo, JP;
Taisuke Yonemura, Tokyo, JP;
Akira Sekiya, Ibaraki, JP;
Katsuo Sakai, Tokyo, JP;
Seiji Okura, Tokyo, JP;
Masaji Sakamura, Tokyo, JP;
Kaoru Abe, Tokyo, JP;
Hitoshi Murata, Tokyo, JP;
Etsuo Wani, Tokyo, JP;
Kenji Kameda, Tokyo, JP;
Yuki Mitsui, Tokyo, JP;
Yutaka Ohira, Tokyo, JP;
Taisuke Yonemura, Tokyo, JP;
Akira Sekiya, Ibaraki, JP;
National Institute of Advanced Industrial Science and Technology, Tokyo, JP;
Canon Anelva Corporation, Kawasaki-shi, JP;
Ulvac, Inc., Chigasaki-shi, JP;
Kanto Denka Kogyo Co., Ltd., Tokyo, JP;
Sanyo Electric Co., Ltd., Moriguchi-shi, JP;
Showa Denko K.K., Tokyo, JP;
Sony Corporation, Tokyo, JP;
Tokyo Eectron Limited, Tokyo, JP;
Hitachi Kokusai Electric Inc., Tokyo, JP;
Panasonic Corporation, Kadoma-shi, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Renesas Electronics Corporation, Kawasaki-shi, JP;
Abstract
A CVD apparatus cleaning method that efficiently removes by-product such as SiOor SiNadhered to and deposited on surfaces of an inner wall, an electrode, and the like in a reaction chamber at a film forming step. In the cleaning method the discharged cleaning gas amount is very small, environmental influences such as global warming can be lessened, and cost can be reduced. A CVD apparatus supplying reactive gas into a reaction chamber and forming a deposited film on a surface of a base material provided in the reaction chamber includes an exhaust gas recycling path recycling an exhaust gas reaching the reaction chamber from downstream of a pump on an exhaust path for exhausting a gas from an inner part of the reaction chamber through the pump.