The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2012

Filed:

Mar. 24, 2008
Applicants:

IN Sang Yoon, Ichon-si, KR;

Hangil Shin, Ichon-si, KR;

Jae Han Chung, Ichon-si, KR;

Deokkyung Yang, Hanam-si, KR;

Inventors:

In Sang Yoon, Ichon-si, KR;

HanGil Shin, Ichon-si, KR;

Jae Han Chung, Ichon-si, KR;

DeokKyung Yang, Hanam-si, KR;

Assignee:

STATS ChipPAC Ltd., Singapore, SG;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit package system includes: providing a stackable integrated circuit package system having a base encapsulation and a recess therein; stacking a top integrated circuit package system, having a top encapsulation with a protruding portion, with the stackable integrated circuit package system with the protruding portion aligned and matched within the recess; and connecting the top integrated circuit package system and the stackable integrated circuit package system.


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