The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2012

Filed:

Aug. 31, 2007
Applicants:

Shigeru Kasai, Nirasaki, JP;

Hiroyuki Miyashita, Nirasaki, JP;

Masatake Yoneda, Nirasaki, JP;

Tomohiro Suzuki, Nirasaki, JP;

Sumi Tanaka, Nirasaki, JP;

Masamichi Nomura, Nirasaki, JP;

Miwa Shimizu, Nirasaki, JP;

Inventors:

Shigeru Kasai, Nirasaki, JP;

Hiroyuki Miyashita, Nirasaki, JP;

Masatake Yoneda, Nirasaki, JP;

Tomohiro Suzuki, Nirasaki, JP;

Sumi Tanaka, Nirasaki, JP;

Masamichi Nomura, Nirasaki, JP;

Miwa Shimizu, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/26 (2006.01); C21D 1/74 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is an annealing apparatus, which is free from a problem of reduced light energy efficiency resulted by the reduction of light emission amount due to a heat generation and capable of maintaining stable performance. The apparatus includes: a processing chamberfor accommodating a wafer W; heating sourcesandincluding LEDsand facing the surface of the wafer W to irradiate light on the wafer W; light-transmitting membersandarranged in alignment with the heating sourcesandto transmit the light emitted from the LEDs; cooling membersandsupporting the light-transmitting membersandat opposite side to the processing chamberto make direct contact with the heating sourcesandand made of a material of high thermal conductivity; and a cooling mechanism for cooling the cooling membersandwith a coolant.

Published as:
TW200830354A; JP2008227435A; CN101405842A; KR20090045314A; US2010038833A1; CN101405842B; KR20110022740A; KR101059314B1; US8246900B2; US2012279944A1; JP5138253B2; TWI389170B;

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